Experts at the Table: Semiconductor Engineering sat down to discuss initial forays into 3D-ICs and what problems early adopters will encounter, with John Ferguson, senior director of product ...
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...
Researchers have created a novel 3D design application that markedly simplifies the wood joining process, while also providing milling machines the instructions to efficiently produce the designed ...
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