5D BIM allows experienced users to create models that demonstrate how changes to materials, layouts, square footage and other design elements affects the appearance of a facility and the cost and ...
IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...
WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...
The design tools Foundry processes for through-silicon vias, temporary bonding and bump architecture The assembly process, such as what is first bonded to what The industry is at the point where the ...
GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC Technology
MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...
November 22, 2013-- Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry's first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with ...
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