3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

Synopsys DesignDash Autonomously Uncovers Untapped, Actionable Design Insights to Accelerate the IC Design Process The digital design flow holds a wealth of information from myriad sources that, ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

As long as there has beena semiconductor industry, each new generation of chips has been characterized by a drive for finer features. This drive has brought increased integration, enhanced ...

With the cost of developing a new semiconductor fab anticipated to surpass US$5.0 billion by 2015, more and more IDMs are adopting a fab-lite outsourcing model. The growth in the merchant foundry ...